World's First Active Cooling Chip 'XMC-2400' Launched to Prevent Smartphone Overheating, Set to Begin Shipping in 2026 – Livedoor News

The world's first active cooling chip “XMC-2400” has been launched to prevent smartphones from overheating, and it is scheduled to start shipping in 2026

In recent years, there has been a growing movement to integrate large-scale language models and personal AI into smartphones, such as Google’s Gemini Nano and Apple’s Apple Intelligence, and demand for super-cooling technology for devices has also increased. Maso has also increased. xMEMS, a US semiconductor development company, has developed a cooling chip that can be installed in devices such as smartphones and tablets.

xMEMS | Active Micro-Cooling | XMC-2400

https://xmems.com/products/microcooling/

xMEMS XMC-2400: The World's First 1mm Thin Active Micro Cooling Fan on a Chip – YouTube

First-of-its-kind 'cooling chip' could keep AI smartphones from overheating — with first devices due in 2026 | Live Science

https://www.livescience.com/technology/electronics/1st-of-its-kind-cooling-chip-could-prevent-ai-smartphones-from-overheating-with-1st-devices-launching-in-2026

Unlike devices like laptops, many smartphones don’t use active cooling systems like fans, but instead rely on passive cooling systems that use heat dissipation from heat sinks. In fact, Samsung’s Galaxy S24 introduced a technology called a “vapor chamber,” and the iPhone 15 Pro uses a large heat spreader to address thermal issues.

In addition, modern smartphones are equipped with a large number of processor cores and built-in memory, which makes it possible to integrate artificial intelligence, play intensive 3D games, edit videos and use 5G networks. However, despite the improved performance of smartphones, they have become more prone to “throttling”, which limits functional performance when a certain temperature is reached. Therefore, scientists have been developing the “active cooling system” technology, which allows for stronger cooling than “passive” cooling of smartphones.

The XMC-2400 chip developed by xMEMS is only 1mm thick and can be installed in devices such as smartphones and tablets. According to xMEMS, there are ventilation holes on the side or top of the XMC-2400, and it is possible to exchange 39 cubic centimeters of air per second using minimal electricity. Also, unlike conventional fans, it uses a MEMS piezoelectric transducer that uses the piezoelectric effect, which causes materials to change volume when electrical energy is applied. MEMS piezoelectric transducers can generate air pulses by vibrating at ultrasonic frequencies, causing air to flow.

There are two types of XMC-2400: the XMC-2400-S “Side Ventilation” with a vent on the side and the XMC-2400 “Top Ventilation” with a vent on the top. The XMC-2400-S “Side Ventilation” captures the heat generated by the passive cooling system and releases it to the outside. On the other hand, the XMC-2400 “Top Ventilation” sucks in air through the vent in the main unit and blows cool air directly onto heat-generating parts such as the processor and memory to cool them.

“By installing the XMC-2400, the possibility of choking in core components will be reduced, the surface temperature of the smartphone will be reduced, and application performance will be improved,” xMEMS says.

“Our innovative XMC-2400 comes at a critical moment in mobile computing, a challenge that has been a major challenge for manufacturers and consumers,” said Joseph Jiang, CEO of xMEMS. “Today’s devices are so small and thin that active cooling solutions for smartphones and tablets have not been developed until the XMC-2400.”

According to xMEMS, sample shipments of the XMC-2400 to smartphone manufacturers will begin in early 2025, and it will be installed in commercially available smartphones in 2026.