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SoIC (System on Integrated Chip) technology was developed by TSMC and introduced in 2018. It allows chips to be stacked in a 3D structure, which can provide better electrical performance and improved thermal management compared to traditional 2D chip designs.
Quick Read: At a Glance
- Apple will use this SoIC technology for its M5 chips in the future.
- Planned production for 2025 to 2026.
- Advanced technology improves Mac hardware and AI tools.
Expanded cooperation with TSMC
According to the Economic Daily, Apple has expanded its collaboration with TSMC and is working on a hybrid SoIC design that also incorporates carbon fiber thermoplastic composite technology. The design is currently in small pilot production, with the chips slated for mass production in 2025 and 2026, both for new Macs and AI-powered cloud servers.
Plans and forecasts
The first references to the M5 chips have already been spotted in Apple’s official code. Apple has started producing processors for its AI servers, which are manufactured using TSMC’s 3nm process, and plans to mass produce them in the second half of 2025. However, according to Haitong analyst Jeff Pu, Apple plans to build AI servers to work with the M4 chips in 2025. The second half of 2025.
Current usage of M2 Ultra
Currently, Apple’s cloud AI servers may be powered by the multi-connected M2 Ultra chips that were originally designed for desktop Macs only. The use of the advanced M5 chips underscores Apple’s commitment to vertically integrating its supply chain and improving AI capabilities across PCs, cloud servers, and software.
SoIC stands for “System on Integrated Chip,” a technology from TSMC that enables 3D stacking of chips. This improves electrical performance and thermal management compared to traditional 2D designs. SoIC was first introduced in 2018.
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