Apple uses SoIC technology for its M5 chips.

Expanded cooperation with TSMC

According to the Economic Daily, Apple has expanded its collaboration with TSMC and is working on a hybrid SoIC design that also incorporates carbon fiber thermoplastic composite technology. The design is currently in small pilot production, with the chips slated for mass production in 2025 and 2026, both for new Macs and AI-powered cloud servers.

Plans and forecasts

The first references to the M5 chips have already been spotted in Apple’s official code. Apple has started producing processors for its AI servers, which are manufactured using TSMC’s 3nm process, and plans to mass produce them in the second half of 2025. However, according to Haitong analyst Jeff Pu, Apple plans to build AI servers to work with the M4 chips in 2025. The second half of 2025.

Current usage of M2 Ultra

Currently, Apple’s cloud AI servers may be powered by the multi-connected M2 Ultra chips that were originally designed for desktop Macs only. The use of the advanced M5 chips underscores Apple’s commitment to vertically integrating its supply chain and improving AI capabilities across PCs, cloud servers, and software.